Institude of Integrated Mircosystems Funded Project

Project Title:

Development of Packaging Technologies for Micro-Opto-Electro-Mechanical Systems (MOEMS)

Principal Investigator:

Prof Ricky S.W. LEE, Department of Mechanical Engineering, HKUST.

Project Duration:

July 1, 2002 to Dec. 31, 2004

Project Summary:

In general, packaging cost is about 60-80% of the total cost of IC or MEMS devices. Due to the lack of standardized test, the reliability of MEMS packaging is usually uncertain. This project focuses on packaging technology for MOEMS including development of high-density flip-chip-on-chip 3D packaging structure, development of passive alignment with low-viscosity epoxy flow, integrated silicon optical bench (SiOB) for 3D optical interconnect and the reliabilty of MOEMS packaging.

Research Output:

  1. Publication

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